| FEATURES |
| Ÿ |
Higher glass transition temperature |
| Ÿ |
Excellent filling ability |
| Ÿ |
Lower dielectric constant |
| Ÿ |
Thin dielectric and light weight |
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| Ÿ |
Easy to drill by CO2 laser |
| Ÿ |
Even surface for fine line and space usage |
| Ÿ |
Traditional FR-4 processability |
| Ÿ |
UL File number E98983(s) |
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| PRODUCT THICKNESS |
CHARACTERISTICS |
UNIT |
TYPICAL VALUES |
Copper |
μm |
12 (3/8 oz) |
18 (1/2 oz) |
36 (1 oz) |
Resin Thickness |
μm |
35 - 110 |
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| PERFORMANCE LIST |
CHARACTERISTICS |
UNIT |
CONDITIONING |
TYPICAL VALUES |
Glass Transition Temperature |
℃ |
TMA |
160±5 |
℃ |
DSC |
180±5 |
Coefficient of Thermal Expansion(Before Tg) |
In/in/℃ |
TMA |
6x10-5~9x10-5 |
Surface Flatness |
μm |
- |
2-3 |
Flammability |
- |
C-24/23/50+E-24/125 |
V-0 |
Peel Strength H oz |
lb/in |
288℃´10” solder dipping |
7-8 |
Thermal Stress |
SEC |
288℃ solder dipping |
120 |
Permittivity 1MHZ |
- |
C-24/23/50 |
3.6-3.8 |
Loss Tangent 1MHZ |
- |
C-24/23/50 |
0.02-0.04 |
Surface Resistivity |
MΩ |
C-96/35/90 |
1.0´1011 |
Volume Resistivity |
MΩ-cm |
C-96/35/90 |
3.0´1012 |
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| Data shown are nominal values for reference only. |
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| DIELECTRIC CONSTANT AND DISSIPATION FACTOR |
| A. Dielectric Constant ( εr ) |
|
1MHz |
2MHz |
5MHz |
10MHz |
100MHz |
500MHz |
1GHz |
FR4 -1.6 |
4.6007 |
4.5509 |
4.4014 |
4.3561 |
4.2628 |
4.1641 |
4.1101 |
NPRCC |
3.7453 |
3.6973 |
3.5533 |
3.4827 |
3.332 |
3.2497 |
3.2231 |
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| Test Condition : C-24/23/50 |
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| B. Dissipation Factor (tand) |
|
1MHz |
2MHz |
5MHz |
10MHz |
100MHz |
500MHz |
1GHz |
FR4 -1.6 |
0.042751 |
0.037166 |
0.020411 |
0.01491 |
0.011922 |
0.00887 |
0.011303 |
NPRCC |
0.0392 |
0.0373 |
0.031599 |
0.028771 |
0.020463 |
0.016398 |
0.016504 |
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| Test Condition : C-24/23/50 |
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| Measurement Equipment : RF Impedance/Material Analyzer 4291A (Hewlett Packard) |
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| THE MANNER OF LAY-UP |
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LAMINATION |
Recommended press cycles : |
A. 2T2P (2 temperature step / 2 pressure step) |
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| B. 1T2P (1 temperature step / 2 pressure step) |
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| C. Vacuum |
|
Vacuum (mmHg) |
Time (min) |
step 1 |
760 |
0 |
step 2 |
≦50 |
1-5 |
step 3 |
≦50 |
40-60 |
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| Suggestions: |
1. |
Heating rate of material between 70℃ and 140℃, 1-3℃/min is acceptable. |
2. |
Temperature of material over 170℃ must be held for at least 40 min to allow epoxy resin to fully cure. |
3. |
Cooling rate of material should be kept under 2.5℃/min when the temperature of material is over 100℃, in order to avoid introducing twist. |
4. |
A vacuum of less than 50 mmHg will be needed to eliminate voids. |
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